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Incorporated circuits depend vigorously on their interconnects to appropriately work. Copper is ordinarily utilized as an interconnect material; be that as it may, as an innovation hub is pushed over 22 nm, it starts to encounter different issues inferable from grain limit dissipating. Thus, carbon nano tubes are presently viewed as the most potential future association material. Scientists from various establishments used a wide assortment of strategies and methodology, including driver size, repeater measuring, repeater insertion, wire estimating, wire dividing, protecting, and boos table repeater, among others. A lot of these techniques are likewise pertinent to the improvement of CNT-based VLSI interconnects from now on. In this work, we give a careful conversation on the strategies and approaches that have been significant previously, are pertinent in the present, and will be important coming down the line for interconnects of VLSI circuits.